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        TTM is pleased to announce the name change of its Wireless BU. Effective January 1, 2021, Wireless BU is now named RF & Specialty Components BU (RF&S) to better reflect the developing nature of this BU and TTM's intention to support our customers with broad based high performance engineered component solutions.
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        Data Package Checklist

        Data Elements

        • Inner and outer layer data (all copper layers)
        • Soldermask layers
        • Legend layers
        • Aperture list if apertures are not embedded in the Gerber data (RS-274X)
        • Drill file with tool codes and X-Y coordinates of all holes in either ASCII or EIA format
        • IPC 356 netlist or mentor graphics neutral file
        • A readme file that contains an engineering contact and any special instructions

        Blue Print Elements

        • Drawing in Gerber, HPGL, PDF, DXF format, or hardcopy
        • Board outline dimensions including cutouts, chamfers, radii, bevels, scores, etc.
        • Dimension from a reference hole in the board to a corner or to two sides of the board outline
        • A hole chart with the hole symbols on the drawing and the finished hole sizes
        • Material requirements
        • Finished board thickness and tolerance
        • Layer stack-up order
        • Controlled impedance requirements (if applicable)
        • Dimensioned array drawing if the design is to be shipped as a multiple -up array
        • Notes defining any other requirements or specifications pertinent to the design

        Readme File

        • Engineering contact (email and phone)
        • Purchasing contact (email and phone)
        • Quantity desired (if submitted for quotation)
        • Turn-time in days (if submitted for quotation)

         

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