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        TTM is pleased to announce the name change of its Wireless BU. Effective January 1, 2021, Wireless BU is now named RF & Specialty Components BU (RF&S) to better reflect the developing nature of this BU and TTM's intention to support our customers with broad based high performance engineered component solutions.
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        Thermal Management Solutions

        Why Thermal Management

        To operate efficiently and ensure reliability, heat must be removed from heat generating power components.

        As a result of faster speeds, reduced format, and more devices being populated on PCB’s, more heat is being generated that must be removed for efficient operation. The move to sustainable energy increased the demand for energy management electronics, which also create much heat because of the high electrical currents used in these applications (power inverters for solar and wind energy, powertrain electronics for HEV, etc).

        Thermal Management, through various applications, aids in directing heat away from heat generating system components.

        Typical applications for Thermal Management may include:

        Power Applications

        • Power amplifiers
        • DC power supplies
        • Power control systems
        • RF & MW applications

        Automotive

        • Motor control modules
        • Electric brake system
        • Power-train in EV

        High Speed Computing

        LED

        • Lighting systems - Automotive, Industrial, Consumer

        TTM's Thermal Management Solutions

        TTM offers a wide range of Thermal Management types to include Via Farms, Heatsinks/Pallets, Heatsink Coins, Embedded Coins, E-Coin, Press Fit Coin (PFC), Metal In-lay and Solder or Adhesive attach.

        Additionally, TTMs' Thermal Management Solutions include our patented embedded E-Coin technology along with heatsink coin attachment capabilities and heavy copper. Our expertise in RF & Microwave is unmatched in the industry.


        Via Farms

        Via Farms



        Press Fit Coin (PFC) Technology

        Press Fit Coin (PFC) Technology



        E Coin Technology

        E Coin Technology



        Heatsinks

        Heatsinks



        Metal In-lay

        Metal In-lay



        Solder or Adhesive Attach

        Solder or Adhesive Attach

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