RF & Microwave PCBs

TTM applications based approach provides innovative engineering and advanced process capabilities.

From defense/aerospace electronics, medical devices and imaging, or complex telecommunications equipment, TTM supports a wide range of frequency bands (L, S, C, X, Ku, K, Ka, V, W). We have extensive experience with a wide range of low loss laminates and a total of over 70 resin systems.

Our Field Applications Engineering team provides a long history of collaborative engineering support. Qualifications include MIL-PRF-31032, AS 9100, ITAR, IPC 6012 & IPC6018, NADCAP.

Our Capabilities Include:

Tight Etch Tolerances on Critical RF Features

• +/- .0005" standard tolerance on etched features for unplated 0.5oz copper
• Selective plated up layers allowing +/- .0005" etch tolerances
• Exact registration/laser direct imaging
• Front to back registration of etched cores to +/-.001"
  
• Mixed Dielectric constructions
• Buried / Blind / Microvia
• Ormet interconnects
• Multilevel cavity constructions
• Optical mill / drill
• Laser routing
• Sequential lamination
• Formed PCB'S
• Plated edges

Back Drill for Precision Stub Removal

• Mechanical back-drilling (Minimal stub)
• Laser drilling (No stub)
• Laser modified controlled depth drill (Mechanical drill followed by laser cleanup, no stub)

Hole Fill

• Conductive, nonconductive, and partial hole fill options

Thermal Solutions

• Copper coins and slugs
• Metal Core & Metal Back
• Thermally conductive laminates
• Heatsink assembly department to laminate heatsink or interface plates to the circuit boards

Embedded Capabilities

• Planar Resistors
  • Ohmega and Ticer
  • Screened Ink Resistors
• Circulators
  • On board circuit
  • Embedded ferrites

Surface Finishes

• ENIG – electroless nickel, soft immersion gold – standard solder assemblies
• ENEPIG - electroless nickel, electroless palladium, immersion gold
• Hard and soft wirebondable gold
• Immersion silver

Assembly and Test

• RF assembly of connector, surface mount component, drop-in cavity components, hand and automated solder assembly options
• RF test center including 6 Network analyzers with combined frequency sweep coverage of 50MHz to 40GHz.
• Custom anechoic boxes for antenna measurements
• Switch matrix capability for multiple measurements between human interaction