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        TTM is pleased to announce the name change of its Wireless BU. Effective January 1, 2021, Wireless BU is now named RF & Specialty Components BU (RF&S) to better reflect the developing nature of this BU and TTM's intention to support our customers with broad based high performance engineered component solutions.
        TTM Products
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        RF & Microwave PCBs

        TTM applications based approach provides innovative engineering and advanced process capabilities.

        From defense/aerospace electronics, medical devices and imaging, or complex telecommunications equipment, TTM supports a wide range of frequency bands (L, S, C, X, Ku, K, Ka, V, W). We have extensive experience with a wide range of low loss laminates and a total of over 70 resin systems.

        Our Field Applications Engineering team provides a long history of collaborative engineering support. Qualifications include MIL-PRF-31032, AS 9100, ITAR, IPC 6012 & IPC6018, NADCAP.

        Our Capabilities Include:

        Tight Etch Tolerances on Critical RF Features

        • +/- .0005" standard tolerance on etched features for unplated 0.5oz copper
        • Selective plated up layers allowing +/- .0005" etch tolerances
        • Exact registration/laser direct imaging
        • Front to back registration of etched cores to +/-.001"
        • Mixed Dielectric constructions
        • Buried / Blind / Microvia
        • Ormet interconnects
        • Multilevel cavity constructions
        • Optical mill / drill
        • Laser routing
        • Sequential lamination
        • Formed PCB'S
        • Plated edges

        Back Drill for Precision Stub Removal

        • Mechanical back-drilling (Minimal stub)
        • Laser drilling (No stub)
        • Laser modified controlled depth drill (Mechanical drill followed by laser cleanup, no stub)

        Hole Fill

        • Conductive, nonconductive, and partial hole fill options

        Thermal Solutions

        • Copper coins and slugs
        • Metal Core & Metal Back
        • Thermally conductive laminates
        • Heatsink assembly department to laminate heatsink or interface plates to the circuit boards

        Embedded Capabilities

        • Planar Resistors
          • Ohmega and Ticer
          • Screened Ink Resistors
        • Circulators
          • On board circuit
          • Embedded ferrites

        Surface Finishes

        • ENIG – electroless nickel, soft immersion gold – standard solder assemblies
        • ENEPIG - electroless nickel, electroless palladium, immersion gold
        • Hard and soft wirebondable gold
        • Immersion silver

        Assembly and Test

        • RF assembly of connector, surface mount component, drop-in cavity components, hand and automated solder assembly options
        • RF test center including 6 Network analyzers with combined frequency sweep coverage of 50MHz to 40GHz.
        • Custom anechoic boxes for antenna measurements
        • Switch matrix capability for multiple measurements between human interaction