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        TTM is pleased to announce the name change of its Wireless BU. Effective January 1, 2021, Wireless BU is now named RF & Specialty Components BU (RF&S) to better reflect the developing nature of this BU and TTM's intention to support our customers with broad based high performance engineered component solutions.
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        Conventional PCBs

        Conventional PCBs can be any layer count, but rely on conventional drilling and plating technology.

        • Multilayer up to 60+ layers
        • Wide range of laminate options including high temperature, low loss and lead-free laminates
        • Mixed dielectric (hybrid) constructions
        • Panel size up to 30"x 55"
        • Embedded coin, or metal core and metal backed MLB
        • Panel thickness up to .450"
        • RF and microwave circuits
        • Heavy copper (10 oz. outer layer / 5 oz.
          inner layer)
        • Embedded, distributed and discrete passive components
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