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        TTM is pleased to announce the name change of its Wireless BU. Effective January 1, 2021, Wireless BU is now named RF & Specialty Components BU (RF&S) to better reflect the developing nature of this BU and TTM's intention to support our customers with broad based high performance engineered component solutions.
        TTM Products
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        Assembly & System Integration

        TTM offers a one-stop solution leveraging our world class capabilities in manufacturing of complex PCB's and backplane assemblies through full system integration and testing. With real emphasis on bringing world class solutions to our customers in key markets such as Communications, Military and Aerospace, Automotive and Industrial and Medical.

        TTM's ability to leverage our world class PCB, backplane and metal capabilities in lower cost regions allows us to deliver best in class "all under one roof" model solutions to our customers. These wide ranging capabilities allow TTM to deliver world class solutions that benefits the customer's quality, delivery and total cost of acquisition. In addition to a variety of capabilities ranging from level 1 to level 5 integration, TTM also has expertise in many specialized assemblies (including flex and rigid-flex).

        Backplane & System Integration

        Integrated Assembly


        • Press-fit (Compliant - pin)
        • Military QPL (MIL-28870)
        • Compression Mount
        • Surface Mount
        • Wave / Selective Solder
        • Up to 48" x 36"
        • Up to 0.450"+ PCB Thick
        • AOI of Connectors / Pins
        • X-Ray Inspection
        • Level 2/3 Testing (to 44k test points)
        • In Circuit (Level 4)

        System Integration

        • Back Panel Assembly and Test
        • Card Cages, Racks and Chassis
        • Cooling and Power Distribution
        • Copper and Fiber Optic Cabling
        • Full Cabinet Assembly
        • System Design, Simulation and Modeling
        • PCBA Assembly and Test
        • Commercial and Military Qualifications
        • Global Manufacturing
        Standards Based

        Standards Based

        • VME / VME64x
        • VITA41© (VXS)
        • VITA46© (VPX)
        • CompactPCI™
        • microTCA™

        Custom & Specialty Product



        • Press-Fit, SMT & Thru-Hole Assembly
        • MIL-Spec, Types 1,2,3,4
        • Up to 36" x 24"
        • Heavy Copper (High Current Configs.)
        • Passive/Active Comps.
        • Integration w/ Rigid PCBs
        • AOI Inspection
        • X-Ray Inspection
        • Level 2/3 Testing (to 44k test points)
        • Design Services


        • 1-Piece Hermetic SMP / SMPM
        • Blind Solder Interconnect
        • Up to 36" x 24" PCBs via Automated Assembly
        • X-Ray Testing
        • RF Testing


        • Slot Adapters
        • Filter Panels
        • Air Impedance Module
        • IPMI Fan Controller
        Custom Sub-System Assembly

        Custom Sub-System  Assembly

        • Card-Cage thru Cabinet
        • Backplanes / Midplanes
        • Sheet metal / Machined Components
        • Peripheral PCBAs
        • Fan Trays
        • Harnessing / Cabling
        • Power Supplies
        • Functional Test
        • Design Services


        Chassis Assembly

        Chassis Assemblies

        • 4U, 5U, 6U Double-Width
        • 6U, 7U, 8U, 9U Triple/Quad-Width
        • 10U, 11U, 12U Ruggedized
        • ARINC 404 / 600 Flexible Options
        • Flush / Recessed
        • Fan-Tray / Cooling
        • Air Filtering
        • Finish / Graphics

        Flexible Options

        • Up to 12AMCs
        • 1 or 2 PSU slots
        • 1 or 2 MCH slots
        • JTAG (JSM) Slot
        • Telco Alarm Slot
        • Zone 3 Interconnect
        • Slot Pitch
        • RoHS 5/6 or 6/6


        • Slot Adapters
        • Filter Panels
        • Air Impedance Module
        • IPMI Fan Controller