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        TTM is pleased to announce the name change of its Wireless BU. Effective January 1, 2021, Wireless BU is now named RF & Specialty Components BU (RF&S) to better reflect the developing nature of this BU and TTM's intention to support our customers with broad based high performance engineered component solutions.
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        TTM Tech Academy



        Seminars & Webinars

        Upcoming Webinars

        High-Density Interconnect (HDI) Technology
        February 25, 2021 | 10 am EST | 7 am PST

        About this Webinar
        We will explore the history and development of high-density interconnect (HDI) technology, from blind/buried mechanical vias, laser-drilled microvias, and fine trace/space. We will discuss related technologies that allow PCBs to accommodate more connectivity in progressively smaller packages. A dynamic Q&A session lead will follow the 60-minute presentation by our subject matter expert.

        Registration now open!

        Cost Adders: PCB Design for Manufacture (Simplified Chinese presentation)
        March 2, 2021 | 10 am GMT+8

        About this Webinar
        This webinar will provide insight into cost adders and highlight opportunities for cost savings without sacrificing function. These best practices will help improve your overall yield and save resources on your next PCB design. The 60-minute presentation will conclude with an interactive Q&A.

        Registration now open!

        Previous Sessions

        PCB 101: An Introduction to Printed Circuit Board Manufacturing & Technology (Mandarin Chinese)
        Access the Recording
        How Fabrication Process Capabilities Drive DFM Guidelines (English)
        Access the Recording
        Automotive Tech Day (German Language Presentations)

        PCB 101: An Introduction to Printed Circuit Board (“PCB”) Technology
        Access the Recording – Recording Password: mNSJUf8b

        Technologies for High-Reliability / Automotive PCBs
        Access the Recording – Recording Password: AmyMjkV8
        Materials: Selection & Performance (English)
        Access the Recording
        Rigid-Flex (English)
        Access the Recording
        HDI – High Density Interconnect Technology (English)
        Access the Recording
        PCB 101: An Introduction to Printed Circuit Board Manufacturing & Technology (English)
        Access the Recording
        High-Speed Backplane Design & Manufacturing Techniques (English)
        Access the Recording
        Through Via Technology (English)
        Access the Recording
        PCB Fabrication Variables Impacting Signal Integrity (English)
        Access the Recording
        Through Via Technology (Chinese)
        Access the Recording
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